Call for Papers: IEEE MICRO Special Issue on Monolithic 3D

Going vertical is a promising option to continue density scaling
beyond traditional transistor scaling. The initial wave of three-dimensional
architectures have focused on connecting stacked chip layers by through silicon
vias (TSVs). However, the challenges with dimensional scaling of TSVs has
limited the degree of interaction across different layers. New monolithic 3D
integration technologies have enabled nanoscale interconnections, orders of
magnitude smaller than TSVs, providing massive vertical connectivity. This data
connectivity provides new opportunities for micro-architectural and
architectural innovations to reduce the energy associated with data movement
and enhance the performance of applications that operate on massive amount of
data. The integration of heterogeneous technologies within the same chip can
also drive innovations in algorithms and system realizations. This special
issue of IEEE Micro will
explore academic and industrial research on all topics related to monolithic 3D

Such topics include, but are not limited to:

Survey and tutorial
on monolithic process technologies

specific customization leveraging monolithic 3D integration

innovations using monolithic 3D

computational fabrics leveraging 3D interconnects

Thermal and power
analysis of monolithic systems

3D Reconfigurable
Architectures and FPGA Designs

systems on a chip

Network on Chip
fabrics for monolithic 3D technologies

Processor Design
using monolithic 3D

Benchmarking of
processor architectures using different 3D technologies

Submissions due: June 11, 2019

notifications:  July 22, 2019

Revised papers due:
August 15, 2019

notifications:  September 12, 2019

Final versions due:
September 19, 2019

Publication date: Nov/Dec

Submission guidelines

Please see the Write for Us page and the general author guidelines for more information. Please submit electronically
through ScholarOne
, selecting this special-issue option.


the guest editor, Vijay Narayanan (  or the editor-in-chief, Lizy John (

IEEE MICRO Special Issue on Monolithic 3D Architectures