Call for Papers: IEEE MICRO Special Issue on Monolithic 3D
Architectures
Going vertical is a promising option to continue density scaling
beyond traditional transistor scaling. The initial wave of three-dimensional
architectures have focused on connecting stacked chip layers by through silicon
vias (TSVs). However, the challenges with dimensional scaling of TSVs has
limited the degree of interaction across different layers. New monolithic 3D
integration technologies have enabled nanoscale interconnections, orders of
magnitude smaller than TSVs, providing massive vertical connectivity. This data
connectivity provides new opportunities for micro-architectural and
architectural innovations to reduce the energy associated with data movement
and enhance the performance of applications that operate on massive amount of
data. The integration of heterogeneous technologies within the same chip can
also drive innovations in algorithms and system realizations. This special
issue of IEEE Micro will
explore academic and industrial research on all topics related to monolithic 3D
architectures.
Such topics include, but are not limited to:
·
Survey and tutorial
on monolithic process technologies
·
Application
specific customization leveraging monolithic 3D integration
·
Micro-architectural
innovations using monolithic 3D
·
In-memory
computational fabrics leveraging 3D interconnects
·
Thermal and power
analysis of monolithic systems
·
3D Reconfigurable
Architectures and FPGA Designs
·
Heterogeneous
systems on a chip
·
Network on Chip
fabrics for monolithic 3D technologies
·
Processor Design
using monolithic 3D
·
Benchmarking of
processor architectures using different 3D technologies
Submissions due: June 11, 2019
·
Initial
notifications: July 22, 2019
·
Revised papers due:
August 15, 2019
·
Final
notifications: September 12, 2019
·
Final versions due:
September 19, 2019
·
Publication date: Nov/Dec
2019
Submission guidelines
Please see the Write for Us page and the general author guidelines for more information. Please submit electronically
through ScholarOne
Manuscripts, selecting this special-issue option.
Questions?
Contact
the guest editor, Vijay Narayanan (vijay@cse.psu.edu) or the editor-in-chief, Lizy John (ljohn@ece.utexas.edu).