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CALL FOR CONTRIBUTIONS
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IEEE Symposium on Low-Power and High-Speed Chips and Systems
COOL Chips 28
April 16 – 18, 2025
Takeda Hall, The University of Tokyo,
Bunkyo-ku, Tokyo, Japan
https://www.coolchips.org/
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COOL Chips Symposium:
COOL Chips is an International Symposium initiated in 1998
to present advancement of low-power and high-speed chips and
systems. The symposium covers leading-edge technologies in all
areas of microprocessors and their applications.
The COOL Chips 28 is to be held in Tokyo on April 16-18, 2025,
and is targeted at the architecture, design and implementation
of chips and systems with special emphasis on the areas listed
below. All papers are published online via IEEE Xplore.
Especially, selected papers are encouraged to submit to the
IEEE Micro and the special section in the IEICE Transactions
on Electronics.
Areas of Interest:
Contributions are solicited in the following areas:
– Low Power-High Performance Processors and Systems for –
AI, IoT, Multimedia, Digital Consumer Electronics,
Mobile, Graphics, Encryption, Robotics, Automotive,
Networking, Medical, Healthcare, and Biometrics.
– Novel Architectures and Schemes for –
Single Core, Multi/Many-Core, NoC, Embedded Systems,
Reconfigurable Computing, Grid, Ubiquitous,
Dependable Computing, GALS and 3D Integration.
– Cool Software including –
Parallel Schedulers, Embedded Real-time Operating System,
Binary Translations, Compiler Issues and
Low Power Application Techniques.
Call for Papers:
Proposals should consist of a title, the name, job title,
address, phone number and e-mail address of the presenter
in a full paper format (6 pages) or an extended abstract format
(up to 3 pages) describing the product or topic to be presented.
The status of the product or topic should precisely be described.
Proposals will be selected by the program committee’s evaluation
of interest to the audience. Submission should be made through
website. Detailed instructions are in author’s kit obtained from <https://www.coolchips.org/>.
Author Schedule (Paper):
Feb. 7, 2025 Paper/Extended Abstract Submission (Web-site)
Mar. 14, 2025 Acceptance Notified (by e-mail)
Mar. 28, 2025 Final Manuscript Submission
Call for Posters:
You are also invited to submit proposals for poster sessions.
Submission should be made through website. Detailed instructions
are in author’s kit obtained from <https://www.coolchips.org/>.
Author Schedule (Poster):
Mar. 21, 2025 Poster Abstract Submission (Web-site)
Mar. 24, 2025 Poster Acceptance Notified (by e-mail)
Web and Contact:
For more information, please visit <https://www.coolchips.org/>.
For any questions, please contact the Secretariat
<cool_28[at]coolchips.org>.
Sponsors:
The COOL Chips 28 is sponsored by the Technical Committees on
Microprocessors and Microcomputers and Computer Architecture of
the IEEE Computer Society.
In cooperation with the IEICE Electronics Society and IPSJ.
(As of January 9, 2025)