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                  CALL FOR CONTRIBUTIONS

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IEEE Symposium on Low-Power and High-Speed Chips and Systems

                      COOL Chips 27

                   April 17 – 19, 2024

          Takeda Hall, The University of Tokyo, 

                 Bunkyo-ku, Tokyo, Japan

                https://www.coolchips.org/

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COOL Chips Symposium:

COOL Chips is an International Symposium initiated in 1998 

to present advancement of low-power and high-speed chips and 

systems. The symposium covers leading-edge technologies in all 

areas of microprocessors  and their applications. 

The COOL Chips 27 is to be held in Tokyo on April 17-19, 2024, 

and is targeted at the architecture, design and implementation 

of chips and systems with special emphasis on the areas listed 

below. All papers are published online via IEEE Xplore. 

Especially, selected papers are encouraged to submit to the 

IEEE Micro and the special section in the IEICE Transactions 

on Electronics.

Areas of Interest:

Contributions are solicited in the following areas:

– Low Power-High Performance Processors and Systems for –

    AI, IoT, Multimedia, Digital Consumer Electronics, 

    Mobile, Graphics, Encryption, Robotics, Automotive, 

    Networking, Medical, Healthcare, and Biometrics.

– Novel Architectures and Schemes for – 

    Single Core, Multi/Many-Core, NoC, Embedded Systems, 

    Reconfigurable Computing, Grid, Ubiquitous, 

    Dependable Computing, GALS and 3D Integration.

– Cool Software including – 

    Parallel Schedulers, Embedded Real-time Operating System,

    Binary Translations, Compiler Issues and 

    Low Power Application Techniques.

Call for Posters:

You are also invited to submit proposals for poster sessions. 

Submission should be made through website. Detailed instructions 

are in author’s kit obtained from <https://www.coolchips.org/>.

  Author Schedule (Poster):

    Mar. 22, 2024  Poster Abstract Submission (Web-site)

    Mar. 25, 2024  Poster Acceptance Notified (by e-mail)

Web and Contact:

For more information, please visit <https://www.coolchips.org/>.   

For any questions, please contact the Secretariat 

<cool_27[at]coolchips.org>.   

Sponsors:

The COOL Chips 27 is sponsored by the Technical Committees on 

Microprocessors and Microcomputers and Computer Architecture of 

the IEEE Computer Society.(approval pending)       

In cooperation with the IEICE Electronics Society and IPSJ.

(As of March 11, 2024)

COOL Chips 27